(module USB-MICROB-FCI-10103592-EXT (layer F.Cu) (tedit 52F281B1)
  (fp_text reference USB-MICROB-FCI-10103592-EXT (at 2.49936 0) (layer F.SilkS)
    (effects (font (thickness 0.3048)))
  )
  (fp_text value VAL** (at 2.49936 0) (layer F.SilkS) hide
    (effects (font (thickness 0.3048)))
  )
  (fp_arc (start 1.15 2.375) (end 1.15 1.925) (angle 180) (layer Cmts.User) (width 0.2032))
  (fp_arc (start 1.15 -2.375) (end 1.15 -2.825) (angle 180) (layer Cmts.User) (width 0.2032))
  (fp_line (start 0 -1.925) (end 0 1.925) (layer Cmts.User) (width 0.2032))
  (fp_line (start 0 2.825) (end 1.15 2.825) (layer Cmts.User) (width 0.2032))
  (fp_line (start 0 -1.925) (end 1.15 -1.925) (layer Cmts.User) (width 0.2032))
  (fp_line (start 0 1.925) (end 1.15 1.925) (layer Cmts.User) (width 0.2032))
  (fp_line (start 0 -2.825) (end 1.15 -2.825) (layer Cmts.User) (width 0.2032))
  (fp_line (start 0 2.825) (end 0 4.75) (layer Cmts.User) (width 0.2032))
  (fp_line (start 0 -2.825) (end 0 -4.75) (layer Cmts.User) (width 0.2032))
  (pad 5 smd rect (at 4.025 -1.3) (size 1.75 0.4) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016) (clearance 0.2032))
  (pad 4 smd rect (at 4.025 -0.65) (size 1.75 0.4) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016) (clearance 0.2032))
  (pad 3 smd rect (at 4.025 0) (size 1.75 0.4) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016) (clearance 0.2032))
  (pad 2 smd rect (at 4.025 0.65) (size 1.75 0.4) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016) (clearance 0.2032))
  (pad 1 smd rect (at 4.025 1.3) (size 1.75 0.4) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.1016) (clearance 0.2032))
  (pad 0 smd rect (at 1.15 -0.9375) (size 2.1 1.375) (layers F.Cu F.Paste F.Mask))
  (pad 0 smd rect (at 1.15 0.9375) (size 2.1 1.375) (layers F.Cu F.Paste F.Mask))
  (pad 0 smd rect (at 4.23 -2.83) (size 1.46 2.14) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.05))
  (pad 0 smd rect (at 4.23 2.83) (size 1.46 2.14) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.05))
  (pad 0 smd rect (at 2.575 -2.9875) (size 1.35 1.825) (layers F.Cu F.Mask))
  (pad 0 smd rect (at 2.575 2.9875) (size 1.35 1.825) (layers F.Cu F.Mask))
  (pad 0 smd rect (at 1.15 -4) (size 2.1 1.75) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.05))
  (pad 0 smd rect (at 1.15 4) (size 2.1 1.75) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.05))
  (pad 0 thru_hole circle (at 1.2 -4.125) (size 1.5 1.5) (drill 0.9) (layers *.Cu *.Mask))
  (pad 0 thru_hole circle (at 1.2 4.125) (size 1.5 1.5) (drill 0.9) (layers *.Cu *.Mask))
  (pad 0 thru_hole circle (at 4.23 -2.49) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask))
  (pad 0 thru_hole circle (at 4.23 2.49) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask))
)
